"It's like making a computer out of rainbows"
Double rainbows? :)
Using through-silicon vias, Samsung is stacking its memory chips higher and reducing energy consumption. It has a 32GB double data rate-3 (DDR3) RDIMM (Registered Dual-Inline Memory Module) using these through-silicon vias (TSVs) to build this 3D chip. The process technology is 30nm and the RDIMM is built from 4Gbit DDR3 …